|
1993
|
Company
founded in May.
Main business is focused on secondary piping service for semiconductor
wet process tool. |
|
1997
|
Deliver the
first 8” fully auto wet bench. Model type named “VAN” |
|
1998
|
Begin
developing single wafer wet chemical process tool. Model type named
“UFO” |
|
1999
|
ISO 9002
qualified by TUV
Deliver the first CMP slurry mixing system to market |
|
2000
|
Company moved
to the current location. New location equipped with class 10 RD clean
room and class 10k equipment assembly room |
|
2001
|
Semi S2-200
qualified for both wet VAN and UFO by TUV.
Deliver the first fully automatic 12” wet bench.
Deliver the first fully automatic 12” single wafer wet chemical process
tool (UFO) for Cu-Ti etch. |
|
2002
|
ISO 9001
qualified by SGS |
|
2004
|
Deliver the
7th fully automatic 12” wet bench
Deliver the 5th UFO
Deliver the first Cu plating tool |
|
2005
|
Deliver the
first Ni plating tool
Deliver the 10th fully automatic 12” wet bench
Deliver the 8th UFO to market. Process has extended to flux clean,
wafer clean and PR develop. |
|
2006
|
Deliver the
first electro-less plating tool to market
Deliver the 15th UFO. |
|
2007
|
Deliver the
19th UFO
Deliver the 14th fully automatic 12” wet bench |
| 2008 |
The 15th Anniversary Jan. till Apr. 6 sets of 12” and 4 sets of 8” system ordered
Supplemental public issuance (Securities code : 3131) |
