Process application
- PR stripping
- Metal etching
- Flux cleaning
- Electroless nickel
- Electroplating Ni/Cu
 
Solder bumping ( plating ) process flow
 
 
Solder bumping ( printing ) process flow
 
 
 
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No.13, Datong Rd., Hsinchu Industrial Park Taiwan 30352 R.O.C. Tel: 886-3-5972353 Fax: 886-3-5972352
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