As semiconductor process requirements continue to tighten, achieving process consistency and reproducibility within and between individual wafer substrates has become increasingly critical. The Single Wafer Spin Processor offers automated handling and precise positioning through robotic arms, enabling precise control of chemical reactions within the process chamber via flexible parameter settings to meet process requirements. Additionally, the system boasts a compact footprint and includes features such as chemical recycling system, etch endpoint detector, double-sided cleaning, all of which aid in reducing production costs. It is well-suited for various process applications, including Metal Etch, Silicon Etch, Oxide Etch, PR Strip, Wafer Clean, Mask Clean, and more.

Our highly customized wet bench system design can support multi soaking tanks setup for dipping process, optimize process conditions by temperature control mechanism, flow circulation, agitation, ultra/mega-sonic, chemical mixing and spiking mechanism, wafer drying, the advantages are high throughput, low cost and support various wafer/substrate sizes. This system can apply for various wet processes such as Metal Etch, Silicon Etch, Oxide Etch, Nitride Etch, PR Strip, RCA Clean, Glass Clean, Electric Plating, Electroless Plating and more.

Regarding the line space shrinking continuously and 2.5D/3D advanced packaging in semiconductor process development, combined multi-functions in one wet process equipment is getting more and more important, we integrate soaking tank and single wafer spin chamber in this combo system to optimize chemical and physical removal force in wet process. This system can apply for various wet processes such as PR Strip, Metal Lift Off, Carrier Recycle and more.