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UFO-150C Series
Process :
PR Strip, Metal Lift Off
Solutions :
Compound Semiconductors, SiC Chip Manufacturing
Key Features:
- Integration of vertical immersion and spin cleaning functions within the same machine, meeting the simultaneous need for immersion and high-pressure cleaning processes. This optimization enhances cleaning capabilities, reduces production times, and increases output.
- Optimized process chamber design achieves wafer cleanliness meeting sub-micron requirements.
- Stackable process chamber design optimizes machine footprint, minimizing cleanroom space requirements.
- Multiple filtration and recycling mechanisms result in high precious metal reclaim rates, reducing production waste.
- Integration of vertical immersion and spin cleaning functions within the same machine, meeting the simultaneous need for immersion and high-pressure cleaning processes. This optimization enhances cleaning capabilities, reduces production times, and increases output.
- Optimized process chamber design achieves wafer cleanliness meeting sub-micron requirements.
- Stackable process chamber design optimizes machine footprint, minimizing cleanroom space requirements.
- Multiple filtration and recycling mechanisms result in high precious metal reclaim rates, reducing production waste.