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UFO Long Type Series
Process :
Etch, PR Strip, Wafer Clean
Solutions :
Advanced Semiconductor Packaging, 2.5D/3D IC Packaging, Panel-Level Advanced Packaging, Compound Semiconductors, Silicon Wafer Manufacturing, SiC Wafer Manufacturing, MOSFET Backend Processes (BGBM)
Key Features:
- Customizable machine specifications for special processes or oversized substrates to optimize production requirements.
- Integration of an etch endpoint detection system to enhance production efficiency and reduce manufacturing costs.
- Capability to incorporate a concentration monitoring system for improved process stability through precise chemical concentration control.
- Configuration of multi-layer recycling rings and a chemical recycling system to support continuous processing needs while reducing chemical consumption and production costs.
- Static electricity protection mechanism to prevent process defects caused by electrostatic discharge.
- Specifically designed for handling highly warped wafers, effectively addressing wafer transport and clamping challenges.
- Customized solutions for addressing process challenges related to chemical viscosity, foaming, residue, and other characteristics.
- Optimized process chamber flow field design, complemented by two-fluid soft spray cleaning, to enhance wafer cleanliness.
- Customizable options for acid mixing, preheating, and acid supply equipment to support diverse processes.
- Customizable machine specifications for special processes or oversized substrates to optimize production requirements.
- Integration of an etch endpoint detection system to enhance production efficiency and reduce manufacturing costs.
- Capability to incorporate a concentration monitoring system for improved process stability through precise chemical concentration control.
- Configuration of multi-layer recycling rings and a chemical recycling system to support continuous processing needs while reducing chemical consumption and production costs.
- Static electricity protection mechanism to prevent process defects caused by electrostatic discharge.
- Specifically designed for handling highly warped wafers, effectively addressing wafer transport and clamping challenges.
- Customized solutions for addressing process challenges related to chemical viscosity, foaming, residue, and other characteristics.
- Optimized process chamber flow field design, complemented by two-fluid soft spray cleaning, to enhance wafer cleanliness.
- Customizable options for acid mixing, preheating, and acid supply equipment to support diverse processes.