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VAN and DIO Series
Process :
Etch, PR Strip, RCA Clean, Plating
Solutions :
Advanced Semiconductor Packaging, 2.5D/3D IC Packaging, Panel-Level Advanced Packaging, Compound Semiconductors, Silicon Wafer Manufacturing, SiC Wafer Manufacturing, MOSFET Backend Processes (BGBM), Automotive Diodes, Quartz Components, CIS Optical Eleme
Key Features:
- Capability to integrate a concentration monitoring system for enhanced process stability through precise chemical concentration control.
- Customizable options for acid mixing, preheating, and acid supply equipment to accommodate diverse process requirements.
- Compatibility with one-touch chemical change and Auto PM functions to improve equipment maintenance efficiency.
- Enhanced cleaning performance through vertical agitation, ultrasonic agitation, and flow field design.
- Integration of a patented drying module to support dry-in, dry-out requirements, and elevate cleanliness standards.
- Customizable wafer cassette designs to meet various manufacturing needs.
- Capability to integrate a concentration monitoring system for enhanced process stability through precise chemical concentration control.
- Customizable options for acid mixing, preheating, and acid supply equipment to accommodate diverse process requirements.
- Compatibility with one-touch chemical change and Auto PM functions to improve equipment maintenance efficiency.
- Enhanced cleaning performance through vertical agitation, ultrasonic agitation, and flow field design.
- Integration of a patented drying module to support dry-in, dry-out requirements, and elevate cleanliness standards.
- Customizable wafer cassette designs to meet various manufacturing needs.