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Flux Clean
Flux clean systems and wafer clean systems are similar in their functionality; the former is primarily applied to the cleaning of the flux agent during packaging. Flux is intended for increasing the fluidity of tin-lead solder, providing bump to the reflow process, so as to achieve a clean wafer surface. In general, acids are added in fluxes to increase their activity. However, failure to properly remove the acids during reflow would lead to corrosion and electromigration. There are three major types of flux:
GPTC's Flux Clean system features a water soluble flux as a cleaning agent. It uses a high-pressure pump, or nitrogen as a propellant of heated water to the surface of the wafer. See below for a before-and-after flux cleaning process:
- Rosin-based
- Water-soluble
- No-clean
GPTC's Flux Clean system features a water soluble flux as a cleaning agent. It uses a high-pressure pump, or nitrogen as a propellant of heated water to the surface of the wafer. See below for a before-and-after flux cleaning process: