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Micro-Roughness Surface Etching
The purpose of micro-roughness surface etching is to increase metal deposition adhesion. The process uses a mixture of hydrofluoric acid (HF) and nitric acid (HNO3) or wet silicon etching. Special agents are added to the etchant for micro-roughness to wafer surfaces, to increase adhesion.
Figure 1、SEM photograph of an etched wafer
Figure 1、SEM photograph of an etched wafer