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PR Stripper
GPTC's PR stripper single-wafer equipment is designed for effective photoresist removal from 12-inch or 8-inch wafers during wet etching. It uses a single wafer rotation system with the assistance of chemicals, and can be applied to solder bump, copper pillar bump, or other photoresist removals processes in IC packaging. It can also be applied to the removal of residues from dry etching during TSV (Through Silicon Via) in 3DIC.
Figure 1、The above illustration shows the photoresist removal process on solder bump
Figure 1、The above illustration shows the photoresist removal process on solder bump
There is a powerful correlation between resist removal and the selecting of chemicals. Some of the most common chemicals used to remove photoresist on the non-metallic layer are sulfuric acid with hydrogen peroxide, or acetone. Alkaline solution added with hydrogen peroxide, NMP, or DMSO is usually used to remove photoresist on the metal layer. Other than the chemicals, equipment capabilities are also a priority. As 3DIC and WLCSP manufacturing process evolves over time, the characteristics, thickness, and width of the photoresist also post new challenges to manufacturer's processing capabilities. For example, photoresist has to be removed by external forces, or stripped through dissolubility; however, this particular process would affect the setup of the equipment and throughput efficiency; photoresist thickness and bump density would also affect the cleaning process in the micro-bump and copper pillar bump, resulting in incomplete photoresist scum.
Figure 2、A schematic of "before-and-after" photoresist removal
Figure 2、A schematic of "before-and-after" photoresist removal
Mass-produced single wafer PR stripper facilities by GTPC are popular with every reputable packaging companies. GTPC's capable recycling and filtering system in the PR stripper allows up to 95% of the chemicals to be recycled, significantly reducing the use of chemicals. The facilities are designed with an excellent, flexible manufacturing modification capability, and it can be customized for versatile applications, such as the following: adjustable speed to accommodate the spraying of chemicals during the removal process; an efficient rinsing feature to quickly and safely clean off the chemicals; or drying the surface of the wafer through the spin-dry process with nitrogen. These features help to meet different customer demands successfully, for quick and thorough photoresist removal.
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Figure 3、GPTC's PR stripper is shown above on the left. The stripper features three FOUP's (Front Opening Unified Pod) and four cleaning chambers -
Figure 4、On the right is a close-up of the cleaning chamber, where chemicals can be recycled and reused during manufacturing
- Reduction in chemical use
- Efficient throughput
- Capable customization for different demands
- Versatile manufacturing modification