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Wafer Clean
Effective and trustworthy, GPTC's Scrubber(wafer clean) system removes particles on the wafer surface with water. The system is pressure-adjustable to meet various manufacturing demands: the pressure can be increased to rinse off larger particles; the force of the cleaning systems can also be modified for cleaning the micro-bump. Besides pressure adjustments, user can also choose different type of nozzles for one’s cleaning needs: (1) HPC and (2) soft spray. User can choose one of them, or install both of them. See the following for detailed description:
1. HPC
The HPC cleaning system features a high-pressure pump to jet on the wafer surface, effectively removing micro-particles. HPC ensures precise and flexible cleaning of larger particles; it is pressure-adjustable to meet different manufacturing demands.
The figure on the left is a schematic of the wafer cleaning process
The photo on the right shows how HPC is used in wafer clean system
2. Softspray
Gaseous nitrogen is used for the atomization of DI-water with high nitrogen pressure into the nozzle; the vapor is sprayed onto the surface of the wafer. The droplets can be employed to remove particles from the wafer's surface without damaging the substrate. The following photos show that the supply pipelines flanking the nozzle provide gaseous nitrogen and DI-water.
The figure above shows GPTC's soft spray system inside the chamber in the cleaning process
GPTC' wafer clean system has been proven very successful in meeting user needs for rinsing particles larger than 1um. See the following for a close-up of the cleaning process, where a before-and-after illustration is shown. Note that the impurities on the wafer surface are thoroughly treated.
GPTC's cleaning systems are popular for their versatility to meet a variety of demands of custom-made facilities. You can trust GPTC's team of capable designers to custom-create the most suitable model for limited space. See the following for GPTC's primary models:
- the 2-chamber model: this model is your premium choice for a confined space of limited width and height
- the 4-chamber stackable model: this model is an excellent choice for a confined space with sufficient height
- the 4-chamber matrix type: the matrix-type is perfect for a roomy space, and the most popular model at present. See below for a diagram of GPTC's 2 FOUP (front opening unified pod) 4-CHAMBER model